The global hermetic packaging market size was valued at USD 2.83 billion in 2016 and is anticipated to reach USD 5.03 billion by 2025. Packaging refers to the enclosures provided for products intended for storage, sale, distribution and use. These packages involve tins, cans and are barrier sealed to prevent air from entering into cans and help in preserving the contents from decaying. This is one side of the story. An application for hermetic sealing includes semiconductor electronics, thermostats, optical devices, MEMS and switches. Prevention of foreign bodies and water bodies in them is an essential requisite for maintaining proper functioning and reliability.
Hermetic by standard definition goes as
being impervious to air. A cavity sealed microelectronic package that passes
both gross and fine leak test as per TM1014 test method is named hermetic
otherwise christened a “leaker”. The factors boosting hermetic packages include
high-performance and limitations in plastic encapsulate I.C and ceramic
packages on account of industry gravitating towards surface-mount switches.
Restraints for hermetic packages include the on-demand re-start of hermetic
lines as opposed to continuous production lines of plastic packages.
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Segmentation of hermetic packaging by
configuration comprises multilayer ceramic packages, pressed ceramic packages
and metal can packages. Market by type is classified as ceramic-metal sealing
(CERTM), Glass Metal sealing (GTMS), Passivation glass, Transponder glass and
Reed Glass. Market by Application includes transistors, sensors, lasers,
photodiodes, airbag igniters, oscillating crystals, MEMS switches and others.
Market by end-user industry comprises military and defense, aeronautics and
space, automotives, energy and nuclear safety, medical, telecommunication and
others. By geography, the market is further segmented into North America,
Europe, Asia Pacific, MEA and Latin America.
Automotives are further broken down into
airbag initiation, battery protection and RFID transponder operation. Energy and
nuclear safety comprises electrical penetration control, oil and gas
applications, fuel cell manufacturing. Medical truncates into dental
applications and veterinary applications. MEM’s are proven devices of low-cost
and reliability such as gyroscopes and resonators and excel in restricting
chemically inert gases from escaping thanks to the hermetic packaging such as
discrete and wafer level hermetic packaging employed. Electronic packaging is a
science with hermetic ceramic packaging comprising I.C chips in
Dual-Inline-Package (DIP) form which is further divided into two main types
viz: multilayer ceramic packages (LTCC and HTCC) and pressed ceramic packages.
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CERM sealing enables high speed data
transmission with minimum trace. H/LTCC offers significant advantages and hence
indicates vertical growth in this segment. Hermeticity or hermetic packages to
prevent moisture condensation from forming on IC chips and causing corrosion or
occurrence of electro-chemical reactions is reason to hermetically seal the
packages pursuant to military applications. Plastic encapsulate
microelectronics (PEM’s) are still finding favor o account of die passivation
and metallization technology but this is not the end for hermetic sealed
packages with their feature-rich characteristics will find favor in electronics
industry.
Hermetic connectors including DC and RF
connectors machined housing and integrated hermetic electronic packaging are in
use in extreme temperatures for carrying electric current in and out of the
housing and disallow ingress of dust or moisture to settle on the electronic
components. Connectors with specifications such as leak rate of 1x10-5 are
hermetic. Target Audience includes OEM’s, OEM technology solution providers,
Research Institutes, Market research and consulting firms and Technology
Investors.
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