JAN 08 2021: The global Solder Paste Inspection (SPI) System market was valued at $XX million in 2018, and Radiant Research analysts predict the global market size will reach $XX million by the end of 2028, growing at a CAGR of XX% between 2018 and 2028.
This report provides detailed historical analysis of global market for Solder Paste Inspection (SPI) System from 2013-2018, and provides extensive market forecasts from 2019-2028 by region/country and subsectors. It covers the sales volume, price, revenue, gross margin, historical growth and future perspectives in the Solder Paste Inspection (SPI) System market.
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Leading players of Solder Paste Inspection (SPI) System including:
- Koh Young (Korea)
- CyberOptics Corporation
- Test Research, Inc (TRI) (Taiwan)
- MirTec Ltd (Korea)
- PARMI Corp (Korea)
- Viscom AG (Germany)
- ViTrox (Malaysia)
- Vi TECHNOLOGY (France)
- Mek (Marantz Electronics) (Japan)
- CKD Corporation (Japan)
- Pemtron (Korea)
- SAKI Corporation (Japan)
- Machine Vision Products (MVP) (US)
- Caltex Scientific (US)
- ASC International (US)
- Sinic-Tek Vision Technology (China)
- Shenzhen JT Automation Equipment (China)
- Jet Technology (Taiwan)
Market split by Type, can be divided into:
- In-line SPI System
- Off-line SPI System
Market split by Application, can be divided into:
- Automotive Electronics
- Consumer Electronics
- Industrials
- Others
Market split by Sales Channel, can be divided into:
- Direct Channel
- Distribution Channel
Market segment by Region/Country including:
- North America (United States, Canada and Mexico)
- Europe (Germany, UK, France, Italy, Russia and Spain etc.)
- Asia-Pacific (China, Japan, Korea, India, Australia and Southeast Asia etc.)
- South America Brazil, Argentina, Colombia and Chile etc.)
- Middle East & Africa (South Africa, Egypt, Nigeria and Saudi Arabia etc.)
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Table of Contents
Chapter 1 Solder Paste Inspection (SPI) System Market Overview
1.1 Solder Paste Inspection (SPI) System Definition
1.2 Global Solder Paste Inspection (SPI) System Market Size Status and Outlook (2013-2028)
1.3 Global Solder Paste Inspection (SPI) System Market Size Comparison by Region (2013-2028)
1.4 Global Solder Paste Inspection (SPI) System Market Size Comparison by Type (2013-2028)
1.5 Global Solder Paste Inspection (SPI) System Market Size Comparison by Application (2013-2028)
1.6 Global Solder Paste Inspection (SPI) System Market Size Comparison by Sales Channel (2013-2028)
1.7 Solder Paste Inspection (SPI) System Market Dynamics
1.7.1 Market Drivers/Opportunities
1.7.2 Market Challenges/Risks
1.7.3 Market News (Mergers/Acquisitions/ Expansion)
Chapter 2 Solder Paste Inspection (SPI) System Market Segment Analysis by Player
2.1 Global Solder Paste Inspection (SPI) System Sales and Market Share by Player (2016-2018)
2.2 Global Solder Paste Inspection (SPI) System Revenue and Market Share by Player (2016-2018)
2.3 Global Solder Paste Inspection (SPI) System Average Price by Player (2016-2018)
2.4 Players Competition Situation & Trends
Continued…………………
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